Memory / Storage Devices, Storage
EASE M.2 NVMe PCIe SSD 256GB
Availability:
Out of stock
- EASE NVME 256 GB High Speed Gen 3
- Max Sequential Read 2131 Mb/s
- Max Sequential Write 1244 Mb/s
- TBW (Total Bytes Written) 110 TB
- MTBF (Drive Writes Per Day) 1,500,000 Hours
₨ 6,440
Out of stock
CompareBrand |
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Size | 80.00 x 22.00 x 3.5mm | Interface type | M.2 2280 | ||||||
Weight | ≤7g | Flash particles | 3D TLC | ||||||
Controller | SMI/YS(YEESTOR)/Realtek | ||||||||
Capacity | 256GB |
Operating Temperature | DC 3.3V ±5% | ||||||||
Idle power consumption | ≤0.7W | ||||||||
Operating power consumption | ≤1.7W | ||||||||
Data saving | It can be stored at 25 ℃ for more than 10 years | ||||||||
Mean time between failures | 1 million | ||||||||
Error checking and correction | Hardware BCH ECC capable of correcting errors up to 76bit/1KB | ||||||||
Flash management | System automatic bad block management | ||||||||
Operating Temperature | 0°C-70°C | ||||||||
Storage Temperature | -40°C-85°C | ||||||||
Ambient humidity | 5-95% | ||||||||
Max Shock Resistance | 1500G |
Feature | 1.MEDS ensures valuable data is protected | |||||||||
2.SaticDaraRefresh Technology ensures data integrity | ||||||||||
3.SLC cashung accelerates burst performance | ||||||||||
4.Bulit-in LDPC ECC | ||||||||||
5.Device Sleep mode(DEVSLP) supported | ||||||||||
6.PCIE 3.0 interface(backwards compatible with | ||||||||||
7.Supports Security Erase | ||||||||||
8.TRIM Support(OS/driver support required ) | ||||||||||
9.High-reliability 3D TLC NAND flash | ||||||||||
10.S.M.A.R.T. support | ||||||||||
11. User-upgradeable firmware | ||||||||||
12. Temperature sensor | ||||||||||
13. RoHS, FCC, CE | ||||||||||
14. Power Consumption(Idle):0.08W | ||||||||||
15. Power Consumption(Active):2W | ||||||||||
16. Max sequential speeds measured using ATTO 2.46 at queue depth 10. Max IOPS measured using IOMeter 1.1 at queue depth 3.0 | ||||||||||
Product characteristics | 1.Supports PIO mode 0, 1, 2, 3, and 4 | |||||||||
2.Supports DMA modes 0, 1, and 2 | ||||||||||
3.Supports UDMA modes 0, 1, 2, 3, 4, 5, 6, and 7 | ||||||||||
4.Supports static and dynamic wear balancing algorithms | ||||||||||
5.Supports for garbage collection | ||||||||||
6.The space reservation mechanism is supported | ||||||||||
7.Supports power management and intelligent management technologies | ||||||||||
8.Supports full-speed command queuing | ||||||||||
9.Supports for Trim directives | ||||||||||
10.Supports for error checking and correction mechanisms |
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